IC Timeline a special presentation of The Chip History Center.
John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH
Lithography has long been regarded as the queen of wafer fabrication in the driv ...
Dicing equipment is used to cut apart individual die on a wafer. Typically, a di ...
Automatic Test Systems (ATS) encompass a broad range of equipment-in size and in ...
Bonding and inspection has historically been overlooked by upper management in s ...
Ion implanters directly inject dopant atoms into semiconductor wafers. A gas con ...
Assembly equipment consists of those types of equipment used to separate the co ...
Questor systems consist of those types of equipment used in the design, verifica ...
Section 4.8 covers that equipment which does not fit in the other wafer fabricat ...
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