Semiconductor Diffusion & Oxidation

Summary : There are three market segments of the diffusion/oxidation equipment industry. They are diffusion, high pressure oxidation and rapid thermal processing, as depicted in Figure 4.4.0-1.

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Annexure :

The diffusion market is defined by three market segments: diffusion furnaces, high pressure oxidation and rapid thermal processes. These systems are used to grow or deposit thin insulating films and to redistribute dopant layers.

Moore's Law: Original D ...

19 Apr 1965

The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for Electronics Magazine while he worked at Fairchild Semiconductor. This seminal paper would prove to be one of the most important pap ... See more

The Transistor and the ...

30 Jun 1955

The Invention of the Transistor and the Birth of the Information Age. Michael Riordan, co-author of Crystal Fire, discusses how it came to be. ... See more

40 Years Of Moore's Law

06 Jun 2005

Historical perspective on Moore’s Law and its affects on everyday life and economic growth for the world as a whole from the fruits brought by semiconductor technology through a 2005 lens. ... See more

When the death of Moore ...

15 Jan 1996

Crashing into Moore's Wall is like a conspiracy theory: it can never be disproved to the true believers that our industry is about to run into a wall that has never appeared. Back in the mid-nineties, Scientifi ... See more

Moore's Law: Its Death ...

01 Oct 2003

Its Death Has Been Greatly Over-Exaggerated - ISSM 2003 Keynote Presentation ... See more

SEMATECH - An Oral Hist ...

16 Jun 1992

An interview with Dave Anderson ... See more

Semiconductor Dicing Eq ...

Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thre ... See more

Ion Implantation - Deve ...

Ion implanters directly inject dopant atoms into semiconductor wafers. A gas containing atoms or molecules of the desired dopant 'species' is first ionized in an ion source. The ions are then extracted from the ... See more

Packaging Equipment - D ...

The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophistic ... See more

Other Equipment - Devel ...

Section 4.8 covers that equipment which does not fit in the other wafer fabrication equipment categories. VLSI Research now includes two new segments under the Other Equipment classification. These segments are ... See more