The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for E ...
Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconducto ...
The industry was in its childhood? When two or three SEMICON trade shows covered ...
A conversation with Robert N. Noyce and Karel Urbanek
John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH
Lithography has long been regarded as the queen of wafer fabrication in the driv ...
Dicing equipment is used to cut apart individual die on a wafer. Typically, a di ...
There are three market segments of the diffusion/oxidation equipment industry. T ...
Assembly equipment consists of those types of equipment used to separate the co ...
Section 4.8 covers that equipment which does not fit in the other wafer fabricat ...
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