Customer Satisfaction Leadership

Relevant Date :2018-06-15

Summary : VLSI's Customer Satisfaction Survey Celebrates 30 Years of award winning semiconductor equipment companies. A Look Back... 2018 marked the 30th year VLSIresearch has released its annual Customer Satisfaction Survey

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Annexure :

To commemorate this landmark, we are issuing the survey results beginning with the 1988 survey each week. Accolades to the respondents and companies that have supported this unique industry survey.

Moore's Law: Original D ...

19 Apr 1965

The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for Electronics Magazine while he worked at Fairchild Semiconductor. This seminal paper would prove to be one of the most important pap ... See more

Tencor at 20 Years

Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more

Reminiscences from SEMI ...

15 Jul 1971

The industry was in its childhood? When two or three SEMICON trade shows covered the entire world? ... See more

International Standards ...

15 Jun 1990

A conversation with Robert N. Noyce and Karel Urbanek ... See more

John Bardeen and Transi ...

25 Apr 2007

John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH ... See more

Semiconductor Depositio ...

Lithography has long been regarded as the queen of wafer fabrication in the drive towards submicron geometries. But, in recent years problems with depth-of-focus and materials have limited lithography's ability ... See more

Semiconductor Dicing Eq ...

Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thre ... See more

Semiconductor Diffusion ...

There are three market segments of the diffusion/oxidation equipment industry. They are diffusion, high pressure oxidation and rapid thermal processing, as depicted in Figure 4.4.0-1. ... See more

Introduction to Assembl ...

Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises roug ... See more

Other Equipment - Devel ...

Section 4.8 covers that equipment which does not fit in the other wafer fabrication equipment categories. VLSI Research now includes two new segments under the Other Equipment classification. These segments are ... See more