Semiconductor Dicing Equipment

Summary : Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically three mils wide. Dicing equipment becomes more critical as 'streets' become narrower.

Annexure :

Dicing equipment is an essential step in the semiconductor manufactur­ing process. The technology has long been established, though it continues to be affected by trends toward automation. 

You may like this also:

Access to and use of this Website is subject to VLSI's Terms of Use (including Copyright Policy & Claims) and Privacy Policy. By accessing or using this Website you agree to VLSI's Terms of Use (including Copyright Policy & Claims) and Privacy Policy.

Copyright © 2020 VLSI Research Inc. All rights reserved.