Semiconductor Dicing Equipment

Summary : Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically three mils wide. Dicing equipment becomes more critical as 'streets' become narrower.

Click here to view full screen

Annexure :

Dicing equipment is an essential step in the semiconductor manufacturing process. The technology has long been established, though it continues to be affected by trends toward automation.

Tencor at 20 Years

Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more

Moore's Law: 40 Years a ...

01 Jan 2005

In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Eventually, it would come to be known as Moore's Law. This is an overview, published Forty years later, celebrating how it was still g ... See more

When the death of Moore ...

15 Jan 1996

Crashing into Moore's Wall is like a conspiracy theory: it can never be disproved to the true believers that our industry is about to run into a wall that has never appeared. Back in the mid-nineties, Scientifi ... See more

Moore's Law: Its Death ...

01 Oct 2003

Its Death Has Been Greatly Over-Exaggerated - ISSM 2003 Keynote Presentation ... See more

Silicon and the Microel ...

The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more

Semiconductor ATE

Automatic Test Systems (ATS) encompass a broad range of equipment-in size and in function as well as in price. It includes all equipment that is used to electrically verify a device's functionality. VLSI Resear ... See more

Semiconductor Bonding & ...

Bonding and inspection has historically been overlooked by upper management in semiconductor companies. Their attention has been drawn by the enormous capital requirements of wafer fabrication. However, this ... See more

Process Diagnostics - D ...

Process diagnostic equipment is critical to semiconductor manufacture. Though this equipment is not used to directly manufacture devices, it serves to verify consistent and in-control manufacturing processes. ... See more

Etching & Cleaning - De ...

Dry processing methods are chemical processes that use a plasma to drive the reaction. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically, ... See more

Material Handling Syste ...

Material handling equipment serves as a physical, mechanical and electronic interface between test equipment and the device under test (DUT). It consists of three major subsegments commonly referred to as wafer ... See more