Semiconductor Dicing Equipment

Summary : Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically three mils wide. Dicing equipment becomes more critical as 'streets' become narrower.

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Annexure :

Dicing equipment is an essential step in the semiconductor manufacturing process. The technology has long been established, though it continues to be affected by trends toward automation.

The invention of the IC ...

23 Jan 1958

The History of the invention of the Integrated Circuit. Why it wasn't so predictable. Corporate culture played no small part in influencing how a small west coast start-up named Fairchild and a company that mad ... See more

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Semiconductor Depositio ...

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Semiconductor ATE

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Introduction to Assembl ...

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Process Diagnostics - D ...

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Equipment Suppliers - 1 ...

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Introduction to Questor ...

Questor systems consist of those types of equipment used in the design, verification, handling, inspection and test of integrated circuits. This equipment, although critical in assuring device design or design ... See more