Semiconductor Dicing Equipment

Summary : Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. ยท Such streets are typically three mils wide. Dicing equipment becomes more critical as 'streets' become narrower.

Annexure :

Dicing equipment is an essential step in the semiconductor manufactur­ing process. The technology has long been established, though it continues to be affected by trends toward automation. 

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