Semiconductor Dicing Equipment

Summary : Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically three mils wide. Dicing equipment becomes more critical as 'streets' become narrower.

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Annexure :

Dicing equipment is an essential step in the semiconductor manufacturing process. The technology has long been established, though it continues to be affected by trends toward automation.

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