Semiconductor Dicing Equipment

Summary : Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically three mils wide. Dicing equipment becomes more critical as 'streets' become narrower.

Click here to view full screen

Annexure :

Dicing equipment is an essential step in the semiconductor manufacturing process. The technology has long been established, though it continues to be affected by trends toward automation.

Images in Semiconductor ...

16 Jun 2008

Key events drawn from archived documents in VLSI's library. These documents have been carefully selected for their historical significance. ... See more

Silicon Valley Genealog ...

AMD's and Intel's can be traced back to Fairchild and Shockley Transistor with this genealogy of semiconductor start-ups in Silicon Valley. The poster was created by SEMI poster. It shows the history of semicon ... See more

Tencor at 20 Years

Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more

IC Timeline | The Chip ...

IC Timeline a special presentation of The Chip History Center. ... See more

John Bardeen and Transi ...

25 Apr 2007

John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH ... See more

40 Years Of Moore's Law

06 Jun 2005

Historical perspective on Moore’s Law and its affects on everyday life and economic growth for the world as a whole from the fruits brought by semiconductor technology through a 2005 lens. ... See more

SRC 25th Anniversary

01 Jun 2007

The history and accomplishments of the Semiconductor Research Corporation ... See more

Silicon and the Microel ...

The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more

Semiconductor Bonding & ...

Bonding and inspection has historically been overlooked by upper management in semiconductor companies. Their attention has been drawn by the enormous capital requirements of wafer fabrication. However, this ... See more

Introduction to Questor ...

Questor systems consist of those types of equipment used in the design, verification, handling, inspection and test of integrated circuits. This equipment, although critical in assuring device design or design ... See more