Semiconductor Dicing Equipment

Summary : Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically three mils wide. Dicing equipment becomes more critical as 'streets' become narrower.

Click here to view full screen

Annexure :

Dicing equipment is an essential step in the semiconductor manufacturing process. The technology has long been established, though it continues to be affected by trends toward automation.

IC Timeline | The Chip ...

IC Timeline a special presentation of The Chip History Center. ... See more

The invention of the IC ...

23 Jan 1958

The History of the invention of the Integrated Circuit. Why it wasn't so predictable. Corporate culture played no small part in influencing how a small west coast start-up named Fairchild and a company that mad ... See more

International Standards ...

15 Jun 1990

A conversation with Robert N. Noyce and Karel Urbanek ... See more

John Bardeen and Transi ...

25 Apr 2007

John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH ... See more

SRC 25th Anniversary

01 Jun 2007

The history and accomplishments of the Semiconductor Research Corporation ... See more

Microlithography & Mask ...

There are two essential applications for semiconductor lithography equipment. They are lumped together here under the name 'microlithography and mask making'. The two segments consist of mask-making equipment a ... See more

Ion Implantation - Deve ...

Ion implanters directly inject dopant atoms into semiconductor wafers. A gas containing atoms or molecules of the desired dopant 'species' is first ionized in an ion source. The ions are then extracted from the ... See more

Process Diagnostics - D ...

Process diagnostic equipment is critical to semiconductor manufacture. Though this equipment is not used to directly manufacture devices, it serves to verify consistent and in-control manufacturing processes. ... See more

Other Equipment - Devel ...

Section 4.8 covers that equipment which does not fit in the other wafer fabrication equipment categories. VLSI Research now includes two new segments under the Other Equipment classification. These segments are ... See more

Packaging Equipment - D ...

The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophistic ... See more