Semiconductor Bonding & Inspection Equipment

Summary : Bonding and inspection has historically been overlooked by upper management in semiconductor companies. Their attention has been drawn by the enormous capital requirements of wafer fabrication. However, this has been changing as the enormous advances in the front end have driven dramatic need for change in bonding and inspection equipment. The forces driving these changes are increasing die size, lead counts, device speed and finer pad pitches. With die becoming larger and lead counts incre ... See More

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Annexure :

Technological advances in the front erid are bringing about dynamic changes in the back end. Increasing die size, lead count, speed and finer pitches are out dating current bonding equipment. Die and wire bonding sales have more than doubled in the past ten years.

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