Moore's Law: Original Draft 1965

Time Period :1960'sRelevant Date :1965-04-19

Summary : The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for Electronics Magazine while he worked at Fairchild Semiconductor. This seminal paper would prove to be one of the most important papers ever written about the future value of the semiconductor industry to the world.

Moore's Law: 40 Years a ...

01 Jan 2005

In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Eventually, it would come to be known as Moore's Law. This is an overview, published Forty years later, celebrating how it was still g ... See more

Moore's Law: Its Death ...

01 Oct 2003

Its Death Has Been Greatly Over-Exaggerated - ISSM 2003 Keynote Presentation ... See more

Paradigms of Maskless L ...

The replacement of optical lithography with e-beam direct write for semiconductor manufacturing has been predicted since Gordon Moore penned his 1965 paper, writing "It is worth noting that this density of comp ... See more

John Bardeen and Transi ...

25 Apr 2007

John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH ... See more

Intel Timeline from 196 ...

A special presentation of The Chip History Center on Intel Timeline from 1968-1984 ... See more

Semiconductor ATE

Automatic Test Systems (ATS) encompass a broad range of equipment-in size and in function as well as in price. It includes all equipment that is used to electrically verify a device's functionality. VLSI Resear ... See more

Semiconductor Dicing Eq ...

Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thr ... See more

Equipment Suppliers - 1 ...

This section examines the vendors who supply semiconductor manufacturing equipment. There are approximately 534 of them. The top five are shown below in Figure 2.0.0-1. In 1989, these five companies held a ... See more

Packaging Equipment - D ...

The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophisti ... See more

Material Handling Syste ...

Material handling equipment serves as a physical, mechanical and electronic interface between test equipment and the device under test (DUT). It consists of three major subsegments commonly referred to as wafer ... See more