Summary : This section examines the vendors who supply semiconductor manufacturing equipment. There are approximately 534 of them. The top five are shown below in Figure 2.0.0-1. In 1989, these five companies held a 26.4% share of the semiconductor equipment market. The market share for the top five equipment suppliers was virtually unchanged over the 1988 figure, 26.3%. Japan-based firms hold four of the top five position in 1989, as compared to only three in 1988. These are: Tokyo Electron Ltd., Nik ... See More
The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for E ...
The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for Electronics Magazine while he worked at Fairchild Semiconductor. This seminal paper would prove to be one of the most important pap ... See more
Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconducto ...
Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more
Historical perspective on Moore’s Law and its affects on everyday life and eco ...
Historical perspective on Moore’s Law and its affects on everyday life and economic growth for the world as a whole from the fruits brought by semiconductor technology through a 2005 lens. ... See more
The emergence of crystalline silicon and silicon-based material such as silicon- ...
The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more
There are three market segments of the diffusion/oxidation equipment industry. T ...
There are three market segments of the diffusion/oxidation equipment industry. They are diffusion, high pressure oxidation and rapid thermal processing, as depicted in Figure 4.4.0-1. ... See more
Dicing equipment is used to cut apart individual die on a wafer. Typically, a di ...
Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thre ... See more
Bonding and inspection has historically been overlooked by upper management in s ...
Bonding and inspection has historically been overlooked by upper management in semiconductor companies. Their attention has been drawn by the enormous capital requirements of wafer fabrication. However, this ... See more
Ion implanters directly inject dopant atoms into semiconductor wafers. A gas con ...
Ion implanters directly inject dopant atoms into semiconductor wafers. A gas containing atoms or molecules of the desired dopant 'species' is first ionized in an ion source. The ions are then extracted from the ... See more
Access to and use of this Website is subject to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy. By accessing or using this Website you agree to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy.
