IC Timeline | The Chip History Center

Summary : IC Timeline a special presentation of The Chip History Center.

A special presentation of

The Chip History Center

Semiconductor Depositio ...

Lithography has long been regarded as the queen of wafer fabrication in the drive towards submicron geometries. But, in recent years problems with depth-of-focus and materials have limited lithography's ability ... See more

SRC 25th Anniversary

01 Jun 2007

The history and accomplishments of the Semiconductor Research Corporation ... See more

Semiconductor Dicing Eq ...

Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thre ... See more

Silicon and the Microel ...

The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more

Paradigms of Maskless L ...

The replacement of optical lithography with e-beam direct write for semiconductor manufacturing has been predicted since Gordon Moore penned his 1965 paper, writing "It is worth noting that this density of comp ... See more

Ion Implantation - Deve ...

Ion implanters directly inject dopant atoms into semiconductor wafers. A gas containing atoms or molecules of the desired dopant 'species' is first ionized in an ion source. The ions are then extracted from the ... See more

Microlithography & Mask ...

There are two essential applications for semiconductor lithography equipment. They are lumped together here under the name 'microlithography and mask making'. The two segments consist of mask-making equipment a ... See more

Intel Timeline from 196 ...

A special presentation of The Chip History Center on Intel Timeline from 1968-1984 ... See more

Introduction to Assembl ...

Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises roug ... See more

Other Equipment - Devel ...

Section 4.8 covers that equipment which does not fit in the other wafer fabrication equipment categories. VLSI Research now includes two new segments under the Other Equipment classification. These segments are ... See more