Moore's Law: Its Death Has Been Greatly Over-Exaggerated

Relevant Date :2003-10-01

Summary : Its Death Has Been Greatly Over-Exaggerated - ISSM 2003 Keynote Presentation

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Reminiscences from SEMI ...

15 Jul 1971

The industry was in its childhood? When two or three SEMICON trade shows covered the entire world? ... See more

Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more

When the death of Moore ...

15 Jan 1996

Crashing into Moore's Wall is like a conspiracy theory: it can never be disproved to the true believers that our industry is about to run into a wall that has never appeared. Back in the mid-nineties, Scientifi ... See more

Semiconductor Depositio ...

Lithography has long been regarded as the queen of wafer fabrication in the drive towards submicron geometries. But, in recent years problems with depth-of-focus and materials have limited lithography's ability ... See more

Paradigms of Maskless L ...

The replacement of optical lithography with e-beam direct write for semiconductor manufacturing has been predicted since Gordon Moore penned his 1965 paper, writing "It is worth noting that this density of comp ... See more

Transistors to Integrat ...

16 Dec 1947

Transistors to Integrated Circuits: How the early semiconductor industry got from the Lab to the Fab. ... See more

Explore Images of Histo ...

Key images drawn from donated and archived documents in VLSI's library. These images have been carefully selected for their historical significance as they show history in the making. ... See more

Equipment Suppliers - 1 ...

This section examines the vendors who supply semiconductor manufacturing equipment. There are approximately 534 of them. The top five are shown below in Figure 2.0.0-1. In 1989, these five companies held a 26 ... See more

Material Handling Syste ...

Material handling equipment serves as a physical, mechanical and electronic interface between test equipment and the device under test (DUT). It consists of three major subsegments commonly referred to as wafer ... See more

Other Equipment - Devel ...

Section 4.8 covers that equipment which does not fit in the other wafer fabrication equipment categories. VLSI Research now includes two new segments under the Other Equipment classification. These segments are ... See more