Packaging Equipment - Development of

Summary : The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophisticated packaging equipment that could handle finer lead pitches, new package shapes, surface mount, greater thermal dissipation and even new materials.

Click here to view full screen

Annexure :

Historically, IC packaging equipment has been somewhat of a neglected step-child of the semiconductor industry. Commonly referred to as the backend of assembly, it has taken a back seat not only to wafer fabrication equipment but also to dicing and bonding. This attitude results from the fact that sophistication in packaging methods does not matter if the IC cannot be made. However, the neglect that packaging equipment has endured has led to a condition where package technology is often a limiting factor to new product introductions.

You may like this also:

The Transistor and the ...

30 Jun 1955

The Invention of the Transistor and the Birth of the Information Age. Michael Riordan, co-author of Crystal Fire, discusses how it came to be. ... See more

Moore's Law: 40 Years a ...

01 Jan 2005

In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Eventually, it would come to be known as Moore's Law. This is an overview, published Forty years later, celebrating how it was still g ... See more

Semiconductor Depositio ...

Lithography has long been regarded as the queen of wafer fabrication in the drive towards submicron geometries. But, in recent years problems with depth-of-focus and materials have limited lithography's ability ... See more

Paradigms of Maskless L ...

The replacement of optical lithography with e-beam direct write for semiconductor manufacturing has been predicted since Gordon Moore penned his 1965 paper, writing "It is worth noting that this density of comp ... See more

Semiconductor ATE

Automatic Test Systems (ATS) encompass a broad range of equipment-in size and in function as well as in price. It includes all equipment that is used to electrically verify a device's functionality. VLSI Resear ... See more

Environmental Health an ...

15 Sep 1994

The semiconductor industry has always worked hard to have and to maintain extremely high health and safety levels. ... See more

Semiconductor Bonding & ...

Bonding and inspection has historically been overlooked by upper management in semiconductor companies. Their attention has been drawn by the enormous capital requirements of wafer fabrication. However, this ... See more

Other Equipment - Devel ...

Section 4.8 covers that equipment which does not fit in the other wafer fabrication equipment categories. VLSI Research now includes two new segments under the Other Equipment classification. These segments are ... See more

Introduction to Questor ...

Questor systems consist of those types of equipment used in the design, verification, handling, inspection and test of integrated circuits. This equipment, although critical in assuring device design or design ... See more

Process Diagnostics - D ...

Process Diagnostics - D ...

Process diagnostic equipment is critical to semiconductor manufacture. Though this equipment is not used to directly manufacture devices, it serves to verify consistent and in-control manufacturing processes. ... See more

Access to and use of this Website is subject to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy. By accessing or using this Website you agree to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy.

Copyright © 2026 TechInsights Inc. All rights reserved.