Packaging Equipment - Development of

Summary : The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophisti­cated packaging equipment that could han­dle finer lead pitches, new package shapes, surface mount, greater thermal dissipation and even new materials.

Annexure :

Historically, IC packaging equipment has been somewhat of a neglected step-child of the semiconductor industry. Commonly referred to as the backend of assembly, it has taken a back seat not only to wafer fabrication equipment but also to dicing and bonding. This attitude results from the fact that sophistication in packaging methods does not matter if the IC cannot be made. However, the neglect that packaging equip­ment has endured has led to a condition where package technology is often a limiting factor to new product introductions. 

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