Packaging Equipment - Development of

Summary : The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophisticated packaging equipment that could handle finer lead pitches, new package shapes, surface mount, greater thermal dissipation and even new materials.

Click here to view full screen

Annexure :

Historically, IC packaging equipment has been somewhat of a neglected step-child of the semiconductor industry. Commonly referred to as the backend of assembly, it has taken a back seat not only to wafer fabrication equipment but also to dicing and bonding. This attitude results from the fact that sophistication in packaging methods does not matter if the IC cannot be made. However, the neglect that packaging equipment has endured has led to a condition where package technology is often a limiting factor to new product introductions.

You may like this also:

Silicon Valley Genealog ...

AMD's and Intel's can be traced back to Fairchild and Shockley Transistor with this genealogy of semiconductor start-ups in Silicon Valley. The poster was created by SEMI poster. It shows the history of semicon ... See more

John Bardeen and Transi ...

25 Apr 2007

John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH ... See more

Semiconductor Depositio ...

Lithography has long been regarded as the queen of wafer fabrication in the drive towards submicron geometries. But, in recent years problems with depth-of-focus and materials have limited lithography's ability ... See more

Moore's Law: Its Death ...

01 Oct 2003

Its Death Has Been Greatly Over-Exaggerated - ISSM 2003 Keynote Presentation ... See more

Semiconductor ATE

Automatic Test Systems (ATS) encompass a broad range of equipment-in size and in function as well as in price. It includes all equipment that is used to electrically verify a device's functionality. VLSI Resear ... See more

Introduction to Assembl ...

Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises roug ... See more

Process Diagnostics - D ...

Process diagnostic equipment is critical to semiconductor manufacture. Though this equipment is not used to directly manufacture devices, it serves to verify consistent and in-control manufacturing processes. ... See more

Other Equipment - Devel ...

Section 4.8 covers that equipment which does not fit in the other wafer fabrication equipment categories. VLSI Research now includes two new segments under the Other Equipment classification. These segments are ... See more

Material Handling Syste ...

Material handling equipment serves as a physical, mechanical and electronic interface between test equipment and the device under test (DUT). It consists of three major subsegments commonly referred to as wafer ... See more

Process Diagnostics - D ...

Process Diagnostics - D ...

Process diagnostic equipment is critical to semiconductor manufacture. Though this equipment is not used to directly manufacture devices, it serves to verify consistent and in-control manufacturing processes. ... See more

Access to and use of this Website is subject to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy. By accessing or using this Website you agree to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy.

Copyright © 2025 TechInsights Inc. All rights reserved.