Packaging Equipment - Development of

Summary : The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophisticated packaging equipment that could handle finer lead pitches, new package shapes, surface mount, greater thermal dissipation and even new materials.

Click here to view full screen

Annexure :

Historically, IC packaging equipment has been somewhat of a neglected step-child of the semiconductor industry. Commonly referred to as the backend of assembly, it has taken a back seat not only to wafer fabrication equipment but also to dicing and bonding. This attitude results from the fact that sophistication in packaging methods does not matter if the IC cannot be made. However, the neglect that packaging equipment has endured has led to a condition where package technology is often a limiting factor to new product introductions.

You may like this also:

Reminiscences from SEMI ...

15 Jul 1971

The industry was in its childhood? When two or three SEMICON trade shows covered the entire world? ... See more

SEMATECH - An Oral Hist ...

16 Jun 1992

An interview with Dave Anderson ... See more

Semiconductor Dicing Eq ...

Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thre ... See more

Semiconductor Diffusion ...

There are three market segments of the diffusion/oxidation equipment industry. They are diffusion, high pressure oxidation and rapid thermal processing, as depicted in Figure 4.4.0-1. ... See more

Silicon and the Microel ...

The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more

Microlithography & Mask ...

There are two essential applications for semiconductor lithography equipment. They are lumped together here under the name 'microlithography and mask making'. The two segments consist of mask-making equipment a ... See more

Ion Implantation - Deve ...

Ion implanters directly inject dopant atoms into semiconductor wafers. A gas containing atoms or molecules of the desired dopant 'species' is first ionized in an ion source. The ions are then extracted from the ... See more

Explore Images of Histo ...

Key images drawn from donated and archived documents in VLSI's library. These images have been carefully selected for their historical significance as they show history in the making. ... See more

Etching & Cleaning - De ...

Dry processing methods are chemical processes that use a plasma to drive the reaction. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically, ... See more

Introduction to Questor ...

Questor systems consist of those types of equipment used in the design, verification, handling, inspection and test of integrated circuits. This equipment, although critical in assuring device design or design ... See more

Access to and use of this Website is subject to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy. By accessing or using this Website you agree to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy.

Copyright © 2025 TechInsights Inc. All rights reserved.