Packaging Equipment - Development of

Summary : The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophisticated packaging equipment that could handle finer lead pitches, new package shapes, surface mount, greater thermal dissipation and even new materials.

Click here to view full screen

Annexure :

Historically, IC packaging equipment has been somewhat of a neglected step-child of the semiconductor industry. Commonly referred to as the backend of assembly, it has taken a back seat not only to wafer fabrication equipment but also to dicing and bonding. This attitude results from the fact that sophistication in packaging methods does not matter if the IC cannot be made. However, the neglect that packaging equipment has endured has led to a condition where package technology is often a limiting factor to new product introductions.

You may like this also:

The Transistor and the ...

30 Jun 1955

The Invention of the Transistor and the Birth of the Information Age. Michael Riordan, co-author of Crystal Fire, discusses how it came to be. ... See more

Reminiscences from SEMI ...

15 Jul 1971

The industry was in its childhood? When two or three SEMICON trade shows covered the entire world? ... See more

John Bardeen and Transi ...

25 Apr 2007

John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH ... See more

When the death of Moore ...

15 Jan 1996

Crashing into Moore's Wall is like a conspiracy theory: it can never be disproved to the true believers that our industry is about to run into a wall that has never appeared. Back in the mid-nineties, Scientifi ... See more

Moore's Law: Its Death ...

01 Oct 2003

Its Death Has Been Greatly Over-Exaggerated - ISSM 2003 Keynote Presentation ... See more

Silicon and the Microel ...

The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more

Semiconductor ATE

Automatic Test Systems (ATS) encompass a broad range of equipment-in size and in function as well as in price. It includes all equipment that is used to electrically verify a device's functionality. VLSI Resear ... See more

Introduction to Assembl ...

Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises roug ... See more

Explore Images of Histo ...

Key images drawn from donated and archived documents in VLSI's library. These images have been carefully selected for their historical significance as they show history in the making. ... See more

Introduction to Questor ...

Questor systems consist of those types of equipment used in the design, verification, handling, inspection and test of integrated circuits. This equipment, although critical in assuring device design or design ... See more

Access to and use of this Website is subject to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy. By accessing or using this Website you agree to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy.

Copyright © 2026 TechInsights Inc. All rights reserved.