Paradigms of Maskless Lithography, IEEE Lithography Workshop: 1999

Summary : The replacement of optical lithography with e-beam direct write for semiconductor manufacturing has been predicted since Gordon Moore penned his 1965 paper, writing "It is worth noting that this density of components can be achieved by present optical techniques and does not require the more exotic electron beam operations which are being studied for the possibility of making even smaller structures." This paper showed why it never happened.

IEEE Lithography Workshop - Historical Prespective

IEEE Lithography Workshop - Historical Prespective E-Beam

IEEE Lithography Workshop - Economics of Direct Write

IEEE Lithography Workshop - 1974-2004 History & Forcast

IEEE Lithography Workshop - Economics of Direct Write E-beam Mythology

IEEE Lithography Workshop - Economics of Direct Write Data Complxity

IEEE Lithography Workshop - Economics of Direct Write Computional Requirements

IEEE Lithography Workshop - Economics of Direct Write in 1999

IEEE Lithography Workshop - Economics of Direct Write in 2005

IEEE Lithography Workshop - Economics of Direct Write E-Beam

IEEE Lithography Workshop - Practical & Cultural Barriers

IEEE Lithography Workshop - Practical & Cultural Barriers Fear

IEEE Lithography Workshop - Practical & Cultural Barriers Yield

IEEE Lithography Workshop - Practical & Cultural Barriers There's Lots of Competition

IEEE Lithography Workshop - Practical & Cultural Barriers Optical Lithography's History

IEEE Lithography Workshop - Practical & Cultural Barriers Optical Lithography's Future

IEEE Lithography Workshop - Concludions Next Generation Lithography

Silicon Valley Genealog ...

AMD's and Intel's can be traced back to Fairchild and Shockley Transistor with this genealogy of semiconductor start-ups in Silicon Valley. The poster was created by SEMI poster. It shows the history of semicon ... See more

The invention of the IC ...

23 Jan 1958

The History of the invention of the Integrated Circuit. Why it wasn't so predictable. Corporate culture played no small part in influencing how a small west coast start-up named Fairchild and a company that mad ... See more

Moore's Law: 40 Years a ...

01 Jan 2005

In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Eventually, it would come to be known as Moore's Law. This is an overview, published Forty years later, celebrating how it was still g ... See more

International Standards ...

15 Jun 1990

A conversation with Robert N. Noyce and Karel Urbanek ... See more

Introduction to Wafer F ...

Wafer fabrication equipment consists of all those types of equipment used in making and processing raw wafers in forming the finished chips-whether they be discretes or integrated circuits. This segment also in ... See more

Moore's Law: Its Death ...

01 Oct 2003

Its Death Has Been Greatly Over-Exaggerated - ISSM 2003 Keynote Presentation ... See more

Equipment Suppliers - 1 ...

This section examines the vendors who supply semiconductor manufacturing equipment. There are approximately 534 of them. The top five are shown below in Figure 2.0.0-1. In 1989, these five companies held a 26 ... See more

Introduction to Assembl ...

Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises roug ... See more

Etching & Cleaning - De ...

Dry processing methods are chemical processes that use a plasma to drive the reaction. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically, ... See more

Material Handling Syste ...

Material handling equipment serves as a physical, mechanical and electronic interface between test equipment and the device under test (DUT). It consists of three major subsegments commonly referred to as wafer ... See more