Paradigms of Maskless Lithography, IEEE Lithography Workshop: 1999

Summary : The replacement of optical lithography with e-beam direct write for semiconductor manufacturing has been predicted since Gordon Moore penned his 1965 paper, writing "It is worth noting that this density of components can be achieved by present optical techniques and does not require the more exotic electron beam operations which are being studied for the possibility of making even smaller structures." This paper showed why it never happened.

Moore's Law: Original D ...

19 Apr 1965

The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for Electronics Magazine while he worked at Fairchild Semiconductor. This seminal paper would prove to be one of the most important pap ... See more

Moore's Law: 40 Years a ...

01 Jan 2005

In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Eventually, it would come to be known as Moore's Law. This is an overview, published Forty years later, celebrating how it was still g ... See more

Reminiscences from SEMI ...

15 Jul 1971

The industry was in its childhood? When two or three SEMICON trade shows covered the entire world? ... See more

Customer Satisfaction L ...

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VLSI's Customer Satisfaction Survey Celebrates 30 Years of award winning semiconductor equipment companies. A Look Back... 2018 marked the 30th year VLSIresearch has released its annual Customer Satisfaction ... See more

SRC 25th Anniversary

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The history and accomplishments of the Semiconductor Research Corporation ... See more

John Bardeen and Transi ...

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John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH ... See more

Introduction to Wafer F ...

Wafer fabrication equipment consists of all those types of equipment used in making and processing raw wafers in forming the finished chips-whether they be discretes or integrated circuits. This segment also in ... See more

Industry Overview - 198 ...

The sweeping revolution brought about by integrated circuits has caused change not only in electronics, but also in the very act of manufacturing the integrated circuit itself. Process equipment, assembly equip ... See more

Packaging Equipment - D ...

The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophisti ... See more

Microlithography & Mask ...

There are two essential applications for semiconductor lithography equipment. They are lumped together here under the name 'microlithography and mask making'. The two segments consist of mask-making equipment a ... See more