Paradigms of Maskless Lithography, IEEE Lithography Workshop: 1999

Summary : The replacement of optical lithography with e-beam direct write for semiconductor manufacturing has been predicted since Gordon Moore penned his 1965 paper, writing "It is worth noting that this density of components can be achieved by present optical techniques and does not require the more exotic electron beam operations which are being studied for the possibility of making even smaller structures." This paper showed why it never happened.

IC Timeline

IC Timeline a special presentation of The Chip History Center. ... See more

Reminiscences from SEMI ...

15 Jul 1971

The industry was in its childhood? When two or three SEMICON trade shows covered the entire world? ... See more

When the death of Moore ...

15 Jan 1996

Crashing into Moore's Wall is like a conspiracy theory: it can never be disproved to the true believers that our industry is about to run into a wall that has never appeared. Back in the mid-nineties, Scientifi ... See more

Silicon and the Microel ...

The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more

Semiconductor Bonding & ...

Bonding and inspection has historically been overlooked by upper management in semiconductor companies. Their attention has been drawn by the enormous capital requirements of wafer fabrication. However, thi ... See more

Semiconductor Dicing Eq ...

Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thr ... See more

Introduction to Wafer F ...

Wafer fabrication equipment consists of all those types of equipment used in making and processing raw wafers in forming the finished chips-whether they be discretes or integrated circuits. This segment also in ... See more

Industry Overview - 198 ...

The sweeping revolution brought about by integrated circuits has caused change not only in electronics, but also in the very act of manufacturing the integrated circuit itself. Process equipment, assembly equip ... See more

Etching & Cleaning - De ...

Dry processing methods are chemical processes that use a plasma to drive the reaction. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically ... See more

Introduction to Assembl ...

Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises rou ... See more