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In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Even ...
John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH
The history and accomplishments of the Semiconductor Research Corporation
Dicing equipment is used to cut apart individual die on a wafer. Typically, a di ...
The semiconductor industry has always worked hard to have and to maintain extrem ...
Bonding and inspection has historically been overlooked by upper management in s ...
A special presentation of The Chip History Center on Intel Timeline from 1968-19 ...
This section examines the vendors who supply semiconductor manufacturing equipm ...
Section 4.8 covers that equipment which does not fit in the other wafer fabricat ...
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