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Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconducto ...
John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH
The history and accomplishments of the Semiconductor Research Corporation
Dicing equipment is used to cut apart individual die on a wafer. Typically, a di ...
Wafer fabrication equipment consists of all those types of equipment used in mak ...
Key images drawn from donated and archived documents in VLSI's library. These im ...
Bonding and inspection has historically been overlooked by upper management in s ...
Assembly equipment consists of those types of equipment used to separate the co ...
Questor systems consist of those types of equipment used in the design, verifica ...
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