Moore's Law: 40 Years and Counting

Time Period :2000'sRelevant Date :2005-01-01

Summary : In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Eventually, it would come to be known as Moore's Law. This is an overview, published Forty years later, celebrating how it was still going strong in the mid-2000's.

Annexure :

First IC

Intel 8008

SIA 2005 Annual Report

Moore's Law: Original D ...

19 Apr 1965

The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for Electronics Magazine while he worked at Fairchild Semiconductor. This seminal paper would prove to be one of the most important pap ... See more

Moore's Law: Its Death ...

01 Oct 2003

Its Death Has Been Greatly Over-Exaggerated - ISSM 2003 Keynote Presentation ... See more

International Standards ...

15 Jun 1990

A conversation with Robert N. Noyce and Karel Urbanek ... See more

Tencor at 20 Years

Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more

SEMATECH - An Oral Hist ...

16 Jun 1992

An interview with Dave Anderson ... See more

Semiconductor Dicing Eq ...

Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thr ... See more

Equipment Suppliers - 1 ...

This section examines the vendors who supply semiconductor manufacturing equipment. There are approximately 534 of them. The top five are shown below in Figure 2.0.0-1. In 1989, these five companies held a ... See more

Introduction to Assembl ...

Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises rou ... See more

Packaging Equipment - D ...

The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophisti ... See more

Material Handling Syste ...

Material handling equipment serves as a physical, mechanical and electronic interface between test equipment and the device under test (DUT). It consists of three major subsegments commonly referred to as wafer ... See more