Summary : Dry processing methods are chemical processes that use a plasma to drive the reaction. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically, a chemical reactive gas, physical abrasion or a combination of the two are used to perform this process. Etching occurs after the resist processing stage. It involves the selective removal of films not covered by the photoresist to form interconnects, contacts and vias. The type of films ... See More
The Invention of the Transistor and the Birth of the Information Age. Michael Ri ...
The Invention of the Transistor and the Birth of the Information Age. Michael Riordan, co-author of Crystal Fire, discusses how it came to be. ... See more
In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Even ...
In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Eventually, it would come to be known as Moore's Law. This is an overview, published Forty years later, celebrating how it was still g ... See more
Lithography has long been regarded as the queen of wafer fabrication in the driv ...
Lithography has long been regarded as the queen of wafer fabrication in the drive towards submicron geometries. But, in recent years problems with depth-of-focus and materials have limited lithography's ability ... See more
The emergence of crystalline silicon and silicon-based material such as silicon- ...
The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more
There are two essential applications for semiconductor lithography equipment. Th ...
There are two essential applications for semiconductor lithography equipment. They are lumped together here under the name 'microlithography and mask making'. The two segments consist of mask-making equipment a ... See more
Bonding and inspection has historically been overlooked by upper management in s ...
Bonding and inspection has historically been overlooked by upper management in semiconductor companies. Their attention has been drawn by the enormous capital requirements of wafer fabrication. However, this ... See more
Assembly equipment consists of those types of equipment used to separate the co ...
Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises roug ... See more
This section examines the vendors who supply semiconductor manufacturing equipm ...
This section examines the vendors who supply semiconductor manufacturing equipment. There are approximately 534 of them. The top five are shown below in Figure 2.0.0-1. In 1989, these five companies held a 26 ... See more
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