Summary : Dry processing methods are chemical processes that use a plasma to drive the reaction. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically, a chemical reactive gas, physical abrasion or a combination of the two are used to perform this process. Etching occurs after the resist processing stage. It involves the selective removal of films not covered by the photoresist to form interconnects, contacts and vias. The type of films ... See More
The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for E ...
The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for Electronics Magazine while he worked at Fairchild Semiconductor. This seminal paper would prove to be one of the most important pap ... See more
The Invention of the Transistor and the Birth of the Information Age. Michael Ri ...
The Invention of the Transistor and the Birth of the Information Age. Michael Riordan, co-author of Crystal Fire, discusses how it came to be. ... See more
VLSI's Customer Satisfaction Survey Celebrates 30 Years of award winning semicon ...
VLSI's Customer Satisfaction Survey Celebrates 30 Years of award winning semiconductor equipment companies.
A Look Back... 2018 marked the 30th year VLSIresearch has released its annual Customer Satisfaction ... See more
The History of the invention of the Integrated Circuit. Why it wasn't so predict ...
The History of the invention of the Integrated Circuit. Why it wasn't so predictable. Corporate culture played no small part in influencing how a small west coast start-up named Fairchild and a company that mad ... See more
Dicing equipment is used to cut apart individual die on a wafer. Typically, a di ...
Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thre ... See more
Assembly equipment consists of those types of equipment used to separate the co ...
Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises roug ... See more
The early nineties, brought a renaissance to packaging due to a demand for more ...
The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophistic ... See more
The sweeping revolution brought about by integrated circuits has caused change n ...
The sweeping revolution brought about by integrated circuits has caused change not only in electronics, but also in the very act of manufacturing the integrated circuit itself. Process equipment, assembly equip ... See more
Section 4.8 covers that equipment which does not fit in the other wafer fabricat ...
Section 4.8 covers that equipment which does not fit in the other wafer fabrication equipment categories. VLSI Research now includes two new segments under the Other Equipment classification. These segments are ... See more
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