Etching & Cleaning - Development of

Summary : Dry processing methods are chemical processes that use a plasma to drive the reaction. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically, a chemical reactive gas, physical abrasion or a combination of the two are used to perform this process. Etching occurs after the resist processing stage. It involves the selective removal of films not covered by the photoresist to form interconnects, contacts and vias. The type of films ... See More

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Annexure :

There are various etcher technologies on the market today. These fall under two categories: high pressure systems and low pressure systems. The high pressure systems operate at or greater than 50 mTorr and are used for the production of devices that require greater than half-micron geometries. Low pressure devices operate at less than 50 mTorr and are used for the production of devices that require less than halfmicron geometries. The high pressure technologies include conventional planar plasma systems, reactive ion etching (RIE), and magnetically enhanced reactive ion etching (MERIE). The low pressure technologies are electron cyclotron resonance (ECR), helicon wave, inductively or transformer-coupled plasma, and high-density reflected electron (HRe ).

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