Etching & Cleaning - Development of

Summary : Dry processing methods are chemical pro­cesses that use a plasma to drive the reac­tion. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically, a chemical reactive gas, physical abrasion or a combination of the two are used to per­form this process. Etching occurs after the resist processing stage. It involves the selective removal of films not covered by the photoresist to form interconnects, con­tacts and vias. The type of f ... See More

Annexure :

There are various etcher technologies on the market today. These fall under two categories: high pressure systems and low pressure systems. The high pressure sys­tems operate at or greater than 50 mTorr and are used for the production of devices that require greater than half-micron geom­etries. Low pressure devices operate at less than 50 mTorr and are used for the produc­tion of devices that require less than half­micron geometries. The high pressure technologies include conventional planar plasma systems, reactive ion etching (RIE), and magnetically enhanced reactive ion etching (MERIE). The low pressure tech­nologies are electron cyclotron resonance (ECR), helicon wave, inductively or trans­former-coupled plasma, and high-density reflected electron (HRe ).

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