Summary : Dry processing methods are chemical processes that use a plasma to drive the reaction. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically, a chemical reactive gas, physical abrasion or a combination of the two are used to perform this process. Etching occurs after the resist processing stage. It involves the selective removal of films not covered by the photoresist to form interconnects, contacts and vias. The type of films ... See More
AMD's and Intel's can be traced back to Fairchild and Shockley Transistor with t ...
AMD's and Intel's can be traced back to Fairchild and Shockley Transistor with this genealogy of semiconductor start-ups in Silicon Valley. The poster was created by SEMI poster. It shows the history of semicon ... See more
The Invention of the Transistor and the Birth of the Information Age. Michael Ri ...
The Invention of the Transistor and the Birth of the Information Age. Michael Riordan, co-author of Crystal Fire, discusses how it came to be. ... See more
VLSI's Customer Satisfaction Survey Celebrates 30 Years of award winning semicon ...
VLSI's Customer Satisfaction Survey Celebrates 30 Years of award winning semiconductor equipment companies.
A Look Back... 2018 marked the 30th year VLSIresearch has released its annual Customer Satisfaction ... See more
In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Even ...
In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Eventually, it would come to be known as Moore's Law. This is an overview, published Forty years later, celebrating how it was still g ... See more
Crashing into Moore's Wall is like a conspiracy theory: it can never be disprove ...
Crashing into Moore's Wall is like a conspiracy theory: it can never be disproved to the true believers that our industry is about to run into a wall that has never appeared. Back in the mid-nineties, Scientifi ... See more
Dicing equipment is used to cut apart individual die on a wafer. Typically, a di ...
Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thre ... See more
The emergence of crystalline silicon and silicon-based material such as silicon- ...
The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more
This section examines the vendors who supply semiconductor manufacturing equipm ...
This section examines the vendors who supply semiconductor manufacturing equipment. There are approximately 534 of them. The top five are shown below in Figure 2.0.0-1. In 1989, these five companies held a 26 ... See more
The early nineties, brought a renaissance to packaging due to a demand for more ...
The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophistic ... See more
The sweeping revolution brought about by integrated circuits has caused change n ...
The sweeping revolution brought about by integrated circuits has caused change not only in electronics, but also in the very act of manufacturing the integrated circuit itself. Process equipment, assembly equip ... See more
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