Summary : Dry processing methods are chemical processes that use a plasma to drive the reaction. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically, a chemical reactive gas, physical abrasion or a combination of the two are used to perform this process. Etching occurs after the resist processing stage. It involves the selective removal of films not covered by the photoresist to form interconnects, contacts and vias. The type of films ... See More
Key events drawn from archived documents in VLSI's library. These documents have ...
Key events drawn from archived documents in VLSI's library. These documents have been carefully selected for their historical significance. ... See more
The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for E ...
The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for Electronics Magazine while he worked at Fairchild Semiconductor. This seminal paper would prove to be one of the most important pap ... See more
Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconducto ...
Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more
Crashing into Moore's Wall is like a conspiracy theory: it can never be disprove ...
Crashing into Moore's Wall is like a conspiracy theory: it can never be disproved to the true believers that our industry is about to run into a wall that has never appeared. Back in the mid-nineties, Scientifi ... See more
The emergence of crystalline silicon and silicon-based material such as silicon- ...
The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more
Dicing equipment is used to cut apart individual die on a wafer. Typically, a di ...
Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thre ... See more
Ion implanters directly inject dopant atoms into semiconductor wafers. A gas con ...
Ion implanters directly inject dopant atoms into semiconductor wafers. A gas containing atoms or molecules of the desired dopant 'species' is first ionized in an ion source. The ions are then extracted from the ... See more
This section examines the vendors who supply semiconductor manufacturing equipm ...
This section examines the vendors who supply semiconductor manufacturing equipment. There are approximately 534 of them. The top five are shown below in Figure 2.0.0-1. In 1989, these five companies held a 26 ... See more
Access to and use of this Website is subject to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy. By accessing or using this Website you agree to TechInsights' Terms of Use (including Copyright Policy & Claims) and Privacy Policy.
