Silicon and the Microelectronics Revolution

Summary : The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be reviewed.

Courtesy of The Electrochemical Society

Silicon and the Microelectronics Revolution

Chapter 1: Intro thru Disclocation-Free Crystal Growth

Please note the following clarification: on page two,
right column, paragraph two, first portion of the second sentence.
It should have said: Einstein developed his "A and B" coefficients in 1916 - 1917,
which were then utilized to explain laser action in 1959,

Chapter 2: Wafer Mechanics thru Surfaces and Wafer Cleaning

Chapter 3: IC Scaling thru the end

The Transistor and the ...

30 Jun 1955

The Invention of the Transistor and the Birth of the Information Age. Michael Riordan, co-author of Crystal Fire, discusses how it came to be. ... See more

IC Timeline | The Chip ...

IC Timeline a special presentation of The Chip History Center. ... See more

Tencor at 20 Years

Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more

Moore's Law: 40 Years a ...

01 Jan 2005

In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Eventually, it would come to be known as Moore's Law. This is an overview, published Forty years later, celebrating how it was still g ... See more

John Bardeen and Transi ...

25 Apr 2007

John Bardeen and Transistor Physics by Howard R. Huff, International SEMATECH ... See more

SEMATECH - An Oral Hist ...

16 Jun 1992

An interview with Dave Anderson ... See more

Ion Implantation - Deve ...

Ion implanters directly inject dopant atoms into semiconductor wafers. A gas containing atoms or molecules of the desired dopant 'species' is first ionized in an ion source. The ions are then extracted from the ... See more

Introduction to Assembl ...

Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises roug ... See more

Other Equipment - Devel ...

Section 4.8 covers that equipment which does not fit in the other wafer fabrication equipment categories. VLSI Research now includes two new segments under the Other Equipment classification. These segments are ... See more

Material Handling Syste ...

Material handling equipment serves as a physical, mechanical and electronic interface between test equipment and the device under test (DUT). It consists of three major subsegments commonly referred to as wafer ... See more