Semiconductor Deposition

Summary : Lithography has long been regarded as the queen of wafer fabrication in the drive towards submicron geometries. But, in recent years problems with depth-of-focus and materials have limited lithography's ability to drive the industry. Consequently, it has yielded its crown to thin film deposition.

Click here to view full screen

Annexure :

Deposition has replaced lithography as the most important technology in semiconductor manufacturing. Deposition is segmented into CVD, PVD and Epitaxy. CVD has replaced PVD as the most important deposition technology.

You may like this also:

Moore's Law: Original D ...

19 Apr 1965

The Future of Integrated Electronics draft, written by Dr. Gordon E. Moore for Electronics Magazine while he worked at Fairchild Semiconductor. This seminal paper would prove to be one of the most important pap ... See more

IC Timeline

IC Timeline a special presentation of The Chip History Center. ... See more

Moore's Law: 40 Years a ...

01 Jan 2005

In 1965, Gordon Moore sat down to pen his article for Electronics magazine. Eventually, it would come to be known as Moore's Law. This is an overview, published Forty years later, celebrating how it was still g ... See more

Tencor at 20 Years

Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more

Paradigms of Maskless L ...

The replacement of optical lithography with e-beam direct write for semiconductor manufacturing has been predicted since Gordon Moore penned his 1965 paper, writing "It is worth noting that this density of comp ... See more

Explore Images of Histo ...

Key images drawn from donated and archived documents in VLSI's library. These images have been carefully selected for their historical significance as they show history in the making. ... See more

Intel Timeline from 196 ...

A special presentation of The Chip History Center on Intel Timeline from 1968-1984 ... See more

Semiconductor Diffusion ...

There are three market segments of the diffusion/oxidation equipment industry. They are diffusion, high pressure oxidation and rapid thermal processing, as depicted in Figure 4.4.0-1. ... See more

Packaging Equipment - D ...

The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophistic ... See more

Introduction to Assembl ...

Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises roug ... See more

Access to and use of this Website is subject to VLSI's Terms of Use (including Copyright Policy & Claims) and Privacy Policy. By accessing or using this Website you agree to VLSI's Terms of Use (including Copyright Policy & Claims) and Privacy Policy.

Copyright © 2021 VLSI Research Inc. All rights reserved.