Semiconductor Deposition

Summary : Lithography has long been regarded as the queen of wafer fabrication in the drive towards submicron geometries. But, in recent years problems with depth-of-focus and materials have limited lithography's ability to drive the industry. Consequently, it has yielded its crown to thin film deposition.

Click here to view full screen

Annexure :

Deposition has replaced lithography as the most important technology in semiconductor manufacturing. Deposition is segmented into CVD, PVD and Epitaxy. CVD has replaced PVD as the most important deposition technology.

You may like this also:

IC Timeline

IC Timeline a special presentation of The Chip History Center. ... See more

The Transistor and the ...

30 Jun 1955

The Invention of the Transistor and the Birth of the Information Age. Michael Riordan, co-author of Crystal Fire, discusses how it came to be. ... See more

Images in Semiconductor ...

16 Jun 2008

Key events drawn from archived documents in VLSI's library. These documents have been carefully selected for their historical significance. ... See more

SEMATECH - An Oral Hist ...

16 Jun 1992

An interview with Dave Anderson ... See more

Silicon and the Microel ...

The emergence of crystalline silicon and silicon-based material such as silicon-germanium as the premier material and the personnel driving the integrated circuit (IC) microelectronics revolution will be review ... See more

Semiconductor Dicing Eq ...

Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thr ... See more

Semiconductor Bonding & ...

Bonding and inspection has historically been overlooked by upper management in semiconductor companies. Their attention has been drawn by the enormous capital requirements of wafer fabrication. However, thi ... See more

Industry Overview - 198 ...

The sweeping revolution brought about by integrated circuits has caused change not only in electronics, but also in the very act of manufacturing the integrated circuit itself. Process equipment, assembly equip ... See more

Packaging Equipment - D ...

The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophisti ... See more

Ion Implantation - Deve ...

Ion implanters directly inject dopant atoms into semiconductor wafers. A gas containing atoms or molecules of the desired dopant 'species' is first ionized in an ion source. The ions are then extracted from the ... See more

Access to and use of this Website is subject to VLSI's Terms of Use (including Copyright Policy & Claims) and Privacy Policy. By accessing or using this Website you agree to VLSI's Terms of Use (including Copyright Policy & Claims) and Privacy Policy.

Copyright © 2021 VLSI Research Inc. All rights reserved.