Material Handling Systems - Development of

Summary : Material handling equipment serves as a physical, mechanical and electronic interface between test equipment and the device under test (DUT). It consists of three major subsegments commonly referred to as wafer probing equipment, package handling equipment and laser repair systems. (See Presentation 3.4.0-1)

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Annexure :

The material handling industry dates back to the fifties and the introduction of the first wafer probers. Package handlers evolved during the sixties as a move away from manual insertion and testing. Laser repair developed in the sixties as well. It was first used for trimming precision components-mainly thin-film resistors in analog circuits. With the advent of memories, low yields demanded that redu·ndancy be used, so a few extra memory cells began to be placed on the chip, laser trimmers were then used to cut connections to the bad cells and rewrite the lines to the good ones.

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