The AMI Model 2100 is an excellent representative of Second Optical Inspection systems, or 2nd Op, as they were called. Though now long gone, they were once a key function in assembly. Back then, wafers weren’t sawn, they were diced with a diamond scribe and then rolled over a rolling pin to break the wafer into individual die. This resulted in broken dice, raw edges, and many more defects severe enough to destroy the die.
The AMI Model 2100 was designed to detect and mark the defective dice. With it, the operator would first manually step the machine through its learning program then set it to automatically inspect all dice in the remaining lot. Those failing the inspection were marked with red ink, thus leading to the invention of die-picking machines that would pick the good ones and leave the bad ones.
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- Industry code: 1523.00
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