In the News: Technology, Crica 1981

Organization Name :KLA-TencorTime Period :1980'sRelevant Date :1981-06-01

Summary : This technical paper laid out the future of yield management, covering all the issues the industry faced with defects and gave a vision for resolving them. It became the foundation on which KLA was built. Published sometime in 1981, it is a landmark in visionary work.

Tencor at 20 Years

Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more

KLA 200 Series Reticle ...

15 Jun 1984

KLA's Reticle Inspection System was the first automatic inspection system to ensure that killer defects as small as 0.7 microns on both reticles and photomasks would be detected. ... See more

KLA-Tencor - KLA 2020

30 Jun 1985

The tool that sparked the yield management revolution. ... See more

KLA Conquers the Pellic ...

16 Nov 1981

Technology, Circa 1981 – It's often the overlooked news that turn out to be critical turning points. The pellicle was one such event. Being able to inspect them was even more critical and a large barrier to o ... See more

KLA Conquers Phase Shif ...

20 May 1991

Technology, Circa 1991 – As lithography moved into ever lower k factors, the concept of Phase Shifting the light, pioneered my Mark Levinsion at IBM, led to phase shift mask. ... See more

KLA-Tencor - KLA ADD/10 ...

01 Jan 1980

The dawn of automated inspection. KLA's mask inspection tools took over to see what humans could not, launching what would become a great company by pushing barriers aside. ... See more

Intel’s Founding Stra ...

18 Jul 1968

These strategies were what made Intel so successful. ... See more

Varian - The MBE GEN II ...

30 Jun 1985

Not many commercial machines get more exotic than this. It even looks like something out of StarTrek. ... See more

Headway Research - R & ...

R & D spin coater for wafers up to 300 mm in diameter. Alignment system/chuck is for both the 200 mm and 300 mm wafers. ... See more

IBM’s R&D Partnering Mo ...

15 Jan 2010

IBM’s R&D partnering model is one of the great business process innovations of the semiconductor industry. IBM’s model has become the gold standard of competitive R&D partnering. ... See more