Summary : The Drytek DRIE 100 plasma etcher was the template for all cluster tools that would follow.
Dry etching had not yet come into its own back in 1981. Barrel Etchers had been in use for almost five years but were successful mostly when used as ashers to remove photoresist. Planar etching began to make some headway soon after with Alan Reinberg’s invention of the parallel plate reactor. Soon Reactive Ion Etch (RIE) entered the scene. It offered substantially better etch uniformity when processing wafers one at a time, but was very slow. The DRIE-100 was one of the first machines to offer multiple wafer planar reactive ion etch. Despite that, other single wafer etching suppliers had gained the upper hand and Drytek was eventually absorbed into Lam Research. Many of the advances made in this machine survive in modern descendants.
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- Key Contributors: Joseph A. Maher Jr., Art Zafiropoulo†
†Winner of the Bob Graham Award for Marketing Excellence in 2000
- Industry code: 1473.333
- No Discernable copyright notice
Copied with the implied permission of the Copyright Owner - Mfr’s Code: LAM
Annexure :
Dry etching had not yet come into its own back in 1981. Barrel Etchers had been in use for almost five years but were successful mostly when used as ashers to remove photoresist, but they were isotropic. The early eighties would be all about developing planar etchers that were anisotropic, so they could etch fine patterns in films. The Drytek DRIE 100 plasma etcher had multiple chambers and would become the template for all cluster tools that followed, starting in 1987.
