A History Timeline of Automatic Test Equipment

Relevant Date :2006-06-15

Summary : A special presentation of The Chip History Center on History Timeline of Automatic Test Equipment

a special presentation of

The Development of the ...

02 Jan 1983

Megatest's MegaOne was the system that sparked the tester-per-pin revolution (1983, courtesy of Teradyne). Find out more in this video that contains great clips of the state-of-the-art in technology development ... See more

Evaluation of Automated ...

Jerry Hutcheson, VLSI Research's founder, was very active in the test side of the semiconductor business in the early 70's. The following document is his internal notes about tester evaluation, selection criter ... See more

History of Ion Implanta ...

15 Jun 1980

History of Ion Implantation Systems and their importance in the development of semiconductor manufacturing. Includes the roles William Shockley and Liechtenstein based Balzers played in the early development of ... See more

When the death of Moore ...

15 Jan 1996

Crashing into Moore's Wall is like a conspiracy theory: it can never be disproved to the true believers that our industry is about to run into a wall that has never appeared. Back in the mid-nineties, Scientifi ... See more

Semiconductor Dicing Eq ...

Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thre ... See more

Moore's Law: Its Death ...

01 Oct 2003

Its Death Has Been Greatly Over-Exaggerated - ISSM 2003 Keynote Presentation ... See more

Introduction to Wafer F ...

Wafer fabrication equipment consists of all those types of equipment used in making and processing raw wafers in forming the finished chips-whether they be discretes or integrated circuits. This segment also in ... See more

Semiconductor Bonding & ...

Bonding and inspection has historically been overlooked by upper management in semiconductor companies. Their attention has been drawn by the enormous capital requirements of wafer fabrication. However, this ... See more

Other Equipment - Devel ...

Section 4.8 covers that equipment which does not fit in the other wafer fabrication equipment categories. VLSI Research now includes two new segments under the Other Equipment classification. These segments are ... See more

Packaging Equipment - D ...

The early nineties, brought a renaissance to packaging due to a demand for more I/0, smaller sizes, higher power, faster speed and control of thermal properties. These demands drove the need for more sophistic ... See more

A History Timeline of Automatic Test Equipment

a special presentation of

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The Development of the ...

Evaluation of Automated ...

History of Ion Implanta ...

When the death of Moore ...

Semiconductor Dicing Eq ...

Moore's Law: Its Death ...

Introduction to Wafer F ...

Semiconductor Bonding & ...

Other Equipment - Devel ...

Packaging Equipment - D ...