Edwards - Thin Film Deposition System

IBM’s development of ...

22 Sep 1997

IBM was first with copper interconnect for semiconductors. It marked the successful culmination of a decade-long search for a material to replace aluminum. ... See more

Advantest: What made it ...

05 Jan 2006

Toshio Maruyama reflects on the history and future of Advantest and its role in semiconductor ATE. ... See more

Art Zafiropoulo was honored for championing technology through innovative marketing approaches: first with plasma etching and later with “mix and match” lithographic manufacturing strategies. ... See more

Canon - FPA-5000 ES2 Al ...

Canon - FPA-5000 ES2 Aligner :1990s - An early DUV scanner. ... See more

Fusion - 200 PCU Photos ...

The 200PCU Photostabilizer utilizes the standard dual unicassette wafer handling platform. ... See more

GCA - The Mann 3600 Pho ...

30 Jun 1975

Here is the Mann and the man that together started two revolutions in the semiconductor capital equipment industry. ... See more

Headway Research - R & ...

R & D spin coater for wafers up to 300 mm in diameter. Alignment system/chuck is for both the 200 mm and 300 mm wafers. ... See more

Eaton - LSI Series Wafe ...

The Eaton LSI Series has features and performance to solve today's toughest wafer processing problems, and the reliability and flexibility to continue meeting production needs far into the future ... See more

Building a Global Posit ...

16 Mar 2006

The second part of this three-part interview covers Applied Materials in the 1980s and its transformation into a global company. Jim Morgan talks about Japan, the Rule of Three, SEMI, and his vision of a globa ... See more

Applied Materials - Aut ...

Applied Materials - Autolign CA 3400 Mask Aligner :1980-84 - The remnants of a failed merger. ... See more