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Gary Heerssen, AMD's Senior Vice President of Corporate Manufacturing, passed aw ...
Mike Mayberry: VP, Technology and Manufacturing Group, Director of Components Re ...
Tom Franz: Vice President, General Manager, Fab/Sort Manufacturing, Intel: Intel ...
Gary Patton: VP, Semiconductor Research and Development Center, IBM: IBM’s 32n ...
Scott Kulicke, discusses the challenges going forward in semiconductor packaging ...
Will there be a new wafer exposure technology before EUV makes it to production? ...
Ken Schroeder on Process Control in this 2004 interview
Structural vs Functional Test: Which is better?
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