Evolution of the IT Industry

Ultratech’s History ...

29 Sep 2017

Founded in 1979 as Ultratech Stepper, it was the oldest stepper company in the world until its sale to Veeco in 2017. Used in the semiconductor lithography process, its stepper was unique in its use of a 1X len ... See more

Moore’s Law GDP Value ...

13 Feb 2015

How the Moore’s Law raises income in relationship to the economies of the United States and the World. ... See more

International Standards ...

15 Jun 1990

A conversation with Robert N. Noyce and Karel Urbanek ... See more

When the death of Moore ...

15 Jan 1996

Crashing into Moore's Wall is like a conspiracy theory: it can never be disproved to the true believers that our industry is about to run into a wall that has never appeared. Back in the mid-nineties, Scientifi ... See more

Copper Interconnect – ...

15 Jun 1998

The transition from aluminum to copper wiring in semiconductor process technology is discussed in this interview with Anantha Sethuraman, with particular emphasis on the inspection technology and the role marke ... See more

Moore's Law: Its Death ...

01 Oct 2003

Its Death Has Been Greatly Over-Exaggerated - ISSM 2003 Keynote Presentation ... See more

Ion Implantation - Deve ...

Ion implanters directly inject dopant atoms into semiconductor wafers. A gas containing atoms or molecules of the desired dopant 'species' is first ionized in an ion source. The ions are then extracted from the ... See more

Evaluation of Automated ...

Jerry Hutcheson, VLSI Research's founder, was very active in the test side of the semiconductor business in the early 70's. The following document is his internal notes about tester evaluation, selection criter ... See more

Industry Overview - 198 ...

The sweeping revolution brought about by integrated circuits has caused change not only in electronics, but also in the very act of manufacturing the integrated circuit itself. Process equipment, assembly equip ... See more

Material Handling Syste ...

Material handling equipment serves as a physical, mechanical and electronic interface between test equipment and the device under test (DUT). It consists of three major subsegments commonly referred to as wafer ... See more