TRE - 800SLR Wafer Stepper

ASML - PAS 2000 Wafer S ...

30 Jun 1985

Virtually everyone seemed to be entering the semiconductor capital equipment business in the early eighties. An entourage of government bodies, both foreign and domestic, as well as interested but alien busines ... See more

The Rise of ASML

26 Jul 2006

Martin van den Brink, employee number 1 at ASML, describes what it's been like to take on Japan's giants and win. ... See more

Lessons Learned at Appl ...

12 Dec 2005

Dan Maydan gives his tips about how to be successful running a technology company in the lessons learned section. ... See more

MRC - Series 900 In-Lin ...

30 Jun 1975

The semiconductor industry was plunging rapidly into alloy deposition to overcome many separate problems. ... See more

Perkin Elmer - Photo Ga ...

This photo gallery represents a salute to Perkin-Elmer. Though perhaps more well-known as the maker of the Hubble space telescope, Perkin-Elmer is nevertheless one of the grandfathers of the chip making industr ... See more

Building Fairchild Test ...

12 Jan 2006

Jim Bowen talks about how he took Fairchild Test Systems Group from a money loser to the world's largest semiconductor equipment company during the seventies and how mismanagement led to its destruction after h ... See more

IBM’s R&D Partnering ...

10 Jan 2008

The Chip Insider's Cook’s Tour: A deep immersion course in what IBM was doing in 2008 at both Albany Nanotech and at IBM’s Fishkill facility is reviewed by VLSIresearch's Chip Insider in this 2008 article. ... See more

Microair - laminar flow ...

Suspended vertical laminar flow stations from Micro Air fulfill a variety of needs where clean air is required, and where your facility can accommodate suspending to achieve an openness ... See more

The Development of the ...

24 May 2007

In this segment, Wilf Corrigan details the structural ingredients of the ASIC semiconductor business. ... See more

Integrated Technologies ...

The model P 3201 is a low cost, highly efficient dip coating system customarily used in applying precision coatings onto high density, assembled printed circuits, irregular shaped substrates, etc. ... See more