Integrated Technologies - P 3201 Coater

TEL's Clean Track Photoresist Processing System

IBM was first with copper interconnect for semiconductors. It marked the success ...

Dan Maydan gives his tips about how to be successful running a technology compan ...

Applied Materials - AME 8100 Batch Etcher :1980-84 - The blockbuster that remapp ...

R & D spin coater for wafers up to 300 mm in diameter. Alignment system/chuck is ...

The Drytek DRIE 100 plasma etcher was the template for all cluster tools that wo ...

CONVAC Photo mask processing equipment

MultiFab's modular design provides easy reconfiguration, maintenance and repair.

Yan Borodovsky demonstrates what was new in DFM and Computational Lithography at ...

Here is a workhorse of the early industry, the Teledyne TAC model XY540 wafer pr ...