Summary : R & D spin coater for wafers up to 300 mm in diameter. Alignment system/chuck is for both the 200 mm and 300 mm wafers.
The LS22 Series of large substrate spinners is designed for versatility, ease of ...
A conversation with Robert N. Noyce and Karel Urbanek
Tetsuo (Tom) Tsuneishi for providing the strategic vision behind Tokyo Electronâ ...
Significant improvement in manufacturing worthiness for the first Step-and-Scan ...
Advantest - T3342 VLSI Test System :1985-89
Applied Materials - The Omega-Centura System :1990s
Here is another excellent example of an early Second Optical Inspection Station ...
The VideoSem 2010 is a fully automatic vision system for die bond inspection.
Tylan - Baking System
Electronic Visions - EV150 Resist Processing System :1990s
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