Summary : R & D spin coater for wafers up to 300 mm in diameter. Alignment system/chuck is for both the 200 mm and 300 mm wafers.
The LS22 Series of large substrate spinners is designed for versatility, ease of ...
Applied Materials - Precision 5000 CVD, The blockbuster that made cluster tool a ...
Just as the first lights of a new millennium were dawning in 1999, ASML announce ...
Takeda Riken announces plans to enter the US ATE (automatic test equipment) mark ...
An early excimer laser stepper for 0.45 micron.
The APTCON 3000 is a modular spin processing system designed by APT and CONVAC, ...
CONVAC compact equipment is derived from fully developed components of Module 20 ...
The Karl Suss company was one of the first companies to explore commercial X-Ray ...
Applied Materials led the way out of selling products to seeking solutions to cu ...
Deep UV 40KX ULTRACURE Photoresist Stabilization Sytsem
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