Summary : R & D spin coater for wafers up to 300 mm in diameter. Alignment system/chuck is for both the 200 mm and 300 mm wafers.
The LS22 Series of large substrate spinners is designed for versatility, ease of ...
Applied Materials - P5000, Etcher :1985-89 - Followed the 8300, but was eclipsed ...
Andrew S. Grove addresses the evolution of semiconductor manufacturing from the ...
FSI - Polaris, Coating System :1990s
Though not as elegantly encased as the Perkin-Elmer 100, here was Japan’s answ ...
An early excimer laser stepper for 0.45 micron.
Applied Materials - AMS 1000 Silox Reactor :1970s
Anelva - MBE 831 Molecular Beam Epitaxy System :1985-89
The fully automatic TRE - 800SLR Wafer Stepper
Suspended vertical laminar flow stations from Micro Air fulfill a variety of nee ...
Copyright © 2017 VLSI Research Inc. All rights reserved.