Summary : R & D spin coater for wafers up to 300 mm in diameter. Alignment system/chuck is for both the 200 mm and 300 mm wafers.
The LS22 Series of large substrate spinners is designed for versatility, ease of ...
Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconducto ...
Bill Holt on Business Incentives for Semiconductor R&D
They had the world on a string and were sitting on a rainbow, but had no idea of ...
Technology, Circa 1991 – As lithography moved into ever lower k factors, the c ...
Tempress - A unit of general signal - DDC Diffusion furnace
Silicon Valley Group - 90 Series Resist Processing - High Productivity photo pro ...
Cameca - XPWS 301 Proximity Step and Repeat System :1980-84 - Thompson’s x-ray ...
Applied Materials led the way out of selling products to seeking solutions to cu ...
The child of the legendary Cambridge maskless systems.
Access to and use of this Website is subject to VLSI's Terms of Use (including Copyright Policy & Claims) and Privacy Policy. By accessing or using this Website you agree to VLSI's Terms of Use (including Copyright Policy & Claims) and Privacy Policy.
Copyright © 2022 VLSI Research Inc. All rights reserved.