Summary : R & D spin coater for wafers up to 300 mm in diameter. Alignment system/chuck is for both the 200 mm and 300 mm wafers.
The LS22 Series of large substrate spinners is designed for versatility, ease of ...
Just as the first lights of a new millennium were dawning in 1999, ASML announce ...
Canon - FPA-5000 ES2 Aligner :1990s - An early DUV scanner.
Blue M Class A batch ovens are mechanical convection electric chambers that incl ...
Dave Markle, Senior Vice President & Chief Technical Officer at Ultratech, descr ...
An early excimer laser stepper for 0.45 micron.
This ignited the Copper Revolution
The elegant simplicity of this small machine belies the fact that an earlier anc ...
Microlite 150 Series Photostabilizer Systems provide a clean one-step process fo ...
Setek - MS-610 Series Resist Processing
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