ASM/Lawton - Encapsulation Press

Organization Name :ASM/Lawton

Summary : ASM/Lawton - Encapsulation Press :1970s - Helped make all those plastic DIP packages possible.

First Monolithic Silico ...

30 Jun 1955

1961: First Monolithic Silicon IC Chip. Invented by Robert Noyce, Fairchild ... See more

IBM’s development of ...

22 Sep 1997

IBM was first with copper interconnect for semiconductors. It marked the successful culmination of a decade-long search for a material to replace aluminum. ... See more

Advantest: What made it ...

05 Jan 2006

Toshio Maruyama reflects on the history and future of Advantest and its role in semiconductor ATE. ... See more

Ultratech Stepper - Mod ...

Ultratech Stepper - Model 900 H/G Line stepper - Versatile, Adaptable, Flexible ... See more

Inside Intel’s Microp ...

Inside Intel’s Microprocessor’s covers a pictorial and spec history from their first, the 4004, through their Centrino™ P4 with Hyper treading. ... See more

The SUSS ACS200 Microlithography Cluster offers superior process performance and unsurpassed productivity for challenging coating applications including coatings of unusually thick and thin photoresist ... See more

Barry Rapozo and his 20 ...

29 Nov 2004

Barry Rapozo was honored for the establishment of selling processes in wafer fab. He identified and met our industry specific customer needs and brought these selling processes into theindustry. ... See more

Applied Materials - Imp ...

Applied Materials - Implant 9000, Ion Implanter :1985-1989 ... See more

Jerry Hutcheson and his ...

29 Nov 2004

Jerry Hutcheson was honored for pioneering and developing relational databases on the equipment industry that could be consistently maintained and provide a valid history for better decision making. ... See more

Sean Maloney: Dynamic D ...

Sean Maloney, who heads up Intel’s Mobility Group, talks about its new duo, 65 nanometer, and what it all means to you. ... See more