IBM’s 32nm Hi-K Chip Technolog

Summary : Gary Patton: VP, Semiconductor Research and Development Center, IBM: IBM’s 32nm Hi-K Chip Technology
Annexure :

Gary Patton, Vice President of the Semiconductor Research and Development Center of IBM's Systems and Technology Group, on the business tactics behind their implementation of Hi-K strained silicon, Air Gap, & eDRAM as well as their strategy of reducing design costs for 32nm. Find out why some companies are skipping nodes and how they are able to do it.

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