IBM’s 32nm Hi-K Chip Technolog

Summary : Gary Patton: VP, Semiconductor Research and Development Center, IBM: IBM’s 32nm Hi-K Chip Technology
Annexure :

Gary Patton, Vice President of the Semiconductor Research and Development Center of IBM's Systems and Technology Group, on the business tactics behind their implementation of Hi-K strained silicon, Air Gap, & eDRAM as well as their strategy of reducing design costs for 32nm. Find out why some companies are skipping nodes and how they are able to do it.

You may like this also:

Copyright © 2018 VLSI Research Inc. All rights reserved.