Gary Patton, Vice President of the Semiconductor Research and Development Center of IBM's Systems and Technology Group, on the business tactics behind their implementation of Hi-K strained silicon, Air Gap, & eDRAM as well as their strategy of reducing design costs for 32nm. Find out why some companies are skipping nodes and how they are able to do it.
How he turned a technology, critial to the future of Moore's Law and the semicon ...
Rick Wallace: CEO, KLA-Tencor: KLA-Tencor and Accelerating the 45nm Yield Ramp
Jim Bowen talks about how he took Fairchild Test Systems Group from a money lose ...
Art Zafiropoulo: Chairman and CEO, Ultratech: How Organic Growth Beats Acquisiti ...
Jim Bowen talks about how he took Fairchild Test Systems Group from a money lose ...
Mihir on the History of Automation in the Semiconductor Industry
Semiconductor Test Consortium (STC) Panel 2008: Steve Wigley, LTX
Peo Hansson: General Manager of ASM America, Inc.: Performance Improvements in S ...
Mike Splinter: President & CEO of Applied Materials: AMAT: One Year After
Sunit Rikhi: Director of Advanced Design, Logic Technology Development, Intel: D ...
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