Summary : Lithography Panel 2007: Bill Arnold, ASML
Annexure : More than 3 million wafers have been through an ASML immersion tool at this juncture. In addition to the above topics, Bill Arnold draws on a wealth of knowledge gleaned from having lots of immersion lithography tools in the field. He also discusses ASML's latest progress on EUV in Albany and Leuven. We also celebrate what is likely the tenth anniversary of the Twinscan platform's conception. It was conceived with the dream of hitting .25 micron, now it's working on 22 nanometers. Find out why it was so ground breaking and how it changed the world of lithography . . .
