It's been quite a year for IBM's researchers. Before the year was even half over, they had announced major advances in high-k dielectrics for gates, low-k with air-gaps for interconnect, and 3-D stacking technology for packaging. IBM's success in research continues to attract new partners who need access to and want to partner in developing the latest chip technologies. In this video, Steve Longoria of IBM answers questions about how they have been able to make their alliances work, what Common Platform is about, and how they have worked together to develop it into a new business model for semiconductors. Find out why it's more than just a business process - IBM is levering its DFM technology to tightly couple the alliance partners into a manufacturing powerhouse. Find out IBM's strategies for bringing its RF CMOS capability to the alliances for mobility applications.