Assembly & Packaging Challenges

Summary : Scott Kulicke, discusses the challenges going forward in semiconductor packaging and assembly in this 2004 interview. Topics covered include: productivity, effect of new wafer fab processes, early efforts to replace gold wire with copper wire, flip-chip’s failure to take hold, China’s rise, ASE passing Amkor, offshoring semiconductor equipment manufacturing from the United States. And more.
Annexure :

Semiconductor History being made in the 2000’s: Scott Kulicke, discusses the challenges going forward in semiconductor packaging and assembly in this 2004 interview. Topics covered include: Improving wire-bonder productivity, how new wafer fab processes, such as lo-k dielectrics, created yield roadblocks in packaging that slowed the implementation of this new technology. The result required major tool changes in wire-bonder technology and marked a new era where wafer fab and package assembly became closely linked in bringing new nodes to production. The early efforts to replace gold wire with copper wire. What they had to do to overcome it. Why flip chip wasn’t taking over and how long the technology had been in place as a next gen technology. The rise of China in packaging. Why subcon geographical distribution shifted from Korea to Taiwan, with ASE passing Amkor as the market leader in subcon packaging. Being an early mover in offshoring semiconductor equipment manufacturing from the United States to Asia. And more. At the time, Scott was Chairman & CEO of Kulicke & Soffa.

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