Audience Q&A

Interviewed :Jack TrautmanRelevant Date :2003-11-18

Summary : Jack Trautman, Sr VP & GM of ATE Group at Agilent: Audience Q&A

Wilf Corrigan

24 May 2007

The Development of the ...

In this segment, Wilf Corrigan details the structural ingredients of the ASIC semiconductor business. ... See more

Mark Bohr, Intel Fellow, Director of Process Architecture and Integration discusses the launch of Intel's then new P1262 90nm Process in this historic interview. In 2002, 90nm was the cutting edge of semiconduc ... See more

Dan Maydan

01 Dec 2005

Building Applied Materi ...

Dan Maydan talks about how Applied Materials built it into a multi-billion dollar, multi-product company ... See more

Klaus Luther

05 Feb 2008

Semiconductor Test Cons ...

Semiconductor Test Consortium (STC) Panel 2008: Klaus Luther, Infineon ... See more

Mike Goldstein & Daisuke O ...

23 Jan 2008

First 450mm Wafer from ...

Nippon Mining & Metals: Daisuke Oka, Strategic Account Manager & Intel: Mike Goldstein, Principal-Materials Engineer: First 450mm Wafer from Nippon Mining & Metals ... See more

Scott Kulicke

04 Mar 2004

Assembly & Packaging Ch ...

Scott Kulicke, discusses the challenges going forward in semiconductor packaging and assembly in this 2004 interview. Topics covered include: productivity, effect of new wafer fab processes, early efforts to re ... See more