Remembering a Manufacturing Hero

Interviewed :Gary HeerssenRelevant Date :2007-06-13

Summary : Gary Heerssen, AMD's Senior Vice President of Corporate Manufacturing, passed away on December 20, 2004. What a loss . . . to his family, to his coworkers, to AMD, and to the industry. I first got to know Gary in the 80's when the trade war with Ja

Click here to view full screen

Rick Wallace

10 Jul 2007

KLA-Tencor and Accelera ...

Rick Wallace: CEO, KLA-Tencor: KLA-Tencor and Accelerating the 45nm Yield Ramp ... See more

Dan Maydan

12 Dec 2005

Lessons Learned at Appl ...

Dan Maydan gives his tips about how to be successful running a technology company in the lessons learned section. ... See more

Mark Bohr

20 Nov 2003

Intel at 65nm | The Chi ...

Mark Bohr discusses process technology development on Intel's 65nm Process in this 2003 interview. ... See more

Craig Barrett

04 May 2006

Craig Barrett: How Inte ...

Craig describes the origins of manufacturing lore such as Copy Exactly, Intel U, and refsnart in this interview ... See more

Jim Bowen

25 Oct 2006

Eaton's Semiconductor E ...

Eaton's Semiconductor Foray, a case study. It was supposed to be the semiconductor equipment company of the future. ... See more

Yan Borodovsky

13 Sep 2007

Yan Borodovsky on DFM a ...

Yan Borodovsky discusses DFM and Computational Lithography at Intel in historic 2007 interview. He covers what it’s about and how it’s a Chip Making Revolution ... See more

Chiang Yang

18 Oct 2006

Chiang Yang on What’s ...

Intel's Chiang Yang talks about what's new in photomask technology and how Intel Mask Operation (IMO) gives it competitive advantage in this 2006 Interview He describes the latest in Reticle Enhancement Technol ... See more

Nasser Grayeli

05 Dec 2008

Finding Competitive Adv ...

Nasser Grayeli: Vice President, Technology & Manufacturing Group, and Director, Intel: Finding Competitive Advantage in Packaging ... See more

Scott Kulicke

04 Mar 2004

Assembly & Packaging Ch ...

Scott Kulicke, discusses the challenges going forward in semiconductor packaging and assembly in this 2004 interview. Topics covered include: productivity, effect of new wafer fab processes, early efforts to re ... See more

Mike Splinter

05 May 2005

What's New at Applied M ...

Mike Splinter: President & CEO of Applied Materials: What's New at Applied Materials? ... See more